Thermal Management Silicones for Electronics - Curing Silicone Compound - SilCool* Silicone Adhesive-Addition Cure - SilCool* Silicone Grease Compounds - Silicone Adhesive-Condensation Cure - Thermal Conductive Encapsulants & Potting Compounds
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Thermal Management Silicones for Electronics
Thermal Management Solutions from Momentive Performane Materials
Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. |
Thermal Conductive Encapsulants & Potting Compounds |
Momentive Performance Materials\' silicone encapsulants deliver thermal conductive performance, contributing to the long-term reliability of heat-generating electronic components. |
Grade |
Cure Chemistry |
Feature |
Price |
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TIA130G |
N/A |
High thermal conductivity, tacking adhesion. |
Enquiry | TIA216G |
N/A |
Low viscosity, tacky adhesion, fast heat & Room temperature cure |
Enquiry | TIA221G |
N/A |
High thermal conductivity, tacky adhesion, fast heat & Room temperature cure |
Enquiry | |